- Felisac
John Doe
Answered on 8:20 am
The following table and diagrams show the main features of the different 400G transceivers that Arista’s platforms support. All of these transceivers have the same electrical connector interface, which is 8 x 50Gb/s PAM-4 (for a total of 400Gb/s). However, the optical signals can vary depending on the module type. Some modules have 8 x 50Gb/s PAM-4 optical lanes, while others have 4 x 100Gb/s PAM-4 optical lanes. For the latter, a gearbox chip inside the module converts the 8 x 50Gb/s PAM-4 electrical signals (from the board) to the 4 x 100Gb/s PAM-4 signals that the optical signals need.
Block diagrams of each optic listed above are shown below.
People Also Ask
Broadcom Launches the Industry’s First 800G AI Ethernet NIC: Thor Ultra, Fully Compliant with UEC Standards
In a groundbreaking move for AI networking, Broadcom has unveiled the Thor Ultra, the industry’s first 800G AI Ethernet network interface card (NIC) chip that fully complies with the Ultra Ethernet Consortium (UEC) specifications. This innovative PCIe card enables seamless interconnections among hundreds of thousands of diverse XPUs, powering next-generation
Essential Fiber Cleaners and Tools from FiberMall: Your Complete Guide to Maintaining High-Performance Networks
In the fast-paced world of data centers, cloud computing, enterprise networks, and telecommunications, reliable fiber optic connections are the backbone of seamless data transmission. However, even the most advanced fiber optic infrastructure can falter if connectors are contaminated with dust, oils, or debris. This is where high-quality fiber cleaners and
Meta’s GB300 Liquid-Cooled AI Server: Clemente (1U 4xGPU) – Revolutionizing AI Infrastructure
In the fast-evolving world of AI data centers, liquid-cooled servers are the backbone of high-performance computing. If you’re exploring cutting-edge solutions for cloud computing, enterprise networks, or AI-enabled environments, Meta’s GB300 liquid-cooled AI server – codenamed Clemente – stands out. This 1U powerhouse packs 4x GPUs into a compact form
Optical Modules and PCBs: Driving High-Speed Data Transmission in the AI Era
In the fast-paced world of data communication, the demand for efficient, high-bandwidth solutions has never been greater. As AI-driven applications and massive data processing push the boundaries of network performance, optical modules and their integral optical module PCBs have evolved rapidly to meet these challenges. This evolution not only enhances transmission efficiency
Hotchip 2025 Day 0 Tutorials: Essential Insights on AI Workloads, Rack Architectures, and Custom GB200 Solutions
In the ever-evolving world of AI and data center technologies, Hotchip 2025 kicked off with an enriching Day 0 Tutorials lineup. As a staple event in the industry, this year’s sessions served as an appetizing prelude, focusing on data center racks in the morning and kernel programming in the afternoon.
Deep Dive into NVIDIA GB200 Liquid Cooling Plate Design: Advanced Liquid Cooling for AI Chips
Next-generation AI chips like NVIDIA’s GB200 are pushing the boundaries of performance. But this immense power comes at a cost: staggering heat generation. A single GB200 chip package consumes up to 2700 W of power. With such high power in such a compact space, traditional air-cooling systems simply can’t keep up.
Related Articles
800G SR8 and 400G SR4 Optical Transceiver Modules Compatibility and Interconnection Test Report
Version Change Log Writer V0 Sample Test Cassie Test Purpose Test Objects：800G OSFP SR8/400G OSFP SR4/400G Q112 SR4. By conducting corresponding tests, the test parameters meet the relevant industry standards, and the test modules can be normally used for Nvidia (Mellanox) MQM9790 switch, Nvidia (Mellanox) ConnectX-7 network card and Nvidia (Mellanox) BlueField-3, laying a foundation for
Broadcom Launches the Industry’s First 800G AI Ethernet NIC: Thor Ultra, Fully Compliant with UEC Standards
In a groundbreaking move for AI networking, Broadcom has unveiled the Thor Ultra, the industry’s first 800G AI Ethernet network interface card (NIC) chip that fully complies with the Ultra Ethernet Consortium (UEC) specifications. This innovative PCIe card enables seamless interconnections among hundreds of thousands of diverse XPUs, powering next-generation
Essential Fiber Cleaners and Tools from FiberMall: Your Complete Guide to Maintaining High-Performance Networks
In the fast-paced world of data centers, cloud computing, enterprise networks, and telecommunications, reliable fiber optic connections are the backbone of seamless data transmission. However, even the most advanced fiber optic infrastructure can falter if connectors are contaminated with dust, oils, or debris. This is where high-quality fiber cleaners and
Meta’s GB300 Liquid-Cooled AI Server: Clemente (1U 4xGPU) – Revolutionizing AI Infrastructure
In the fast-evolving world of AI data centers, liquid-cooled servers are the backbone of high-performance computing. If you’re exploring cutting-edge solutions for cloud computing, enterprise networks, or AI-enabled environments, Meta’s GB300 liquid-cooled AI server – codenamed Clemente – stands out. This 1U powerhouse packs 4x GPUs into a compact form
Optical Modules and PCBs: Driving High-Speed Data Transmission in the AI Era
In the fast-paced world of data communication, the demand for efficient, high-bandwidth solutions has never been greater. As AI-driven applications and massive data processing push the boundaries of network performance, optical modules and their integral optical module PCBs have evolved rapidly to meet these challenges. This evolution not only enhances transmission efficiency
Hotchip 2025 Day 0 Tutorials: Essential Insights on AI Workloads, Rack Architectures, and Custom GB200 Solutions
In the ever-evolving world of AI and data center technologies, Hotchip 2025 kicked off with an enriching Day 0 Tutorials lineup. As a staple event in the industry, this year’s sessions served as an appetizing prelude, focusing on data center racks in the morning and kernel programming in the afternoon.
Deep Dive into NVIDIA GB200 Liquid Cooling Plate Design: Advanced Liquid Cooling for AI Chips
Next-generation AI chips like NVIDIA’s GB200 are pushing the boundaries of performance. But this immense power comes at a cost: staggering heat generation. A single GB200 chip package consumes up to 2700 W of power. With such high power in such a compact space, traditional air-cooling systems simply can’t keep up.