- Felisac
Harry Collins
Answered on 2:16 am
The maximum power consumption of 400G OSFP and QSFP-DD transceivers depends on the type and specification of the products. However, some general comparisons can be made based on the following information:
OSFP allows higher power consumption of 12~15W, while the QSFP-DD allows lower power consumption of 7~12W.
The QSFP-DD ZR variant has a maximum power consumption of 12W.
The QSFP-DD ZR Plus variant has a maximum power consumption of 15W.
Coherent DWDM transceivers may draw up to as much as 24W per port.
People Also Ask
Optical Modules and PCBs: Driving High-Speed Data Transmission in the AI Era
In the fast-paced world of data communication, the demand for efficient, high-bandwidth solutions has never been greater. As AI-driven applications and massive data processing push the boundaries of network performance, optical modules and their integral optical module PCBs have evolved rapidly to meet these challenges. This evolution not only enhances transmission efficiency
Hotchip 2025 Day 0 Tutorials: Essential Insights on AI Workloads, Rack Architectures, and Custom GB200 Solutions
In the ever-evolving world of AI and data center technologies, Hotchip 2025 kicked off with an enriching Day 0 Tutorials lineup. As a staple event in the industry, this year’s sessions served as an appetizing prelude, focusing on data center racks in the morning and kernel programming in the afternoon.
Deep Dive into NVIDIA GB200 Liquid Cooling Plate Design: Advanced Liquid Cooling for AI Chips
Next-generation AI chips like NVIDIA’s GB200 are pushing the boundaries of performance. But this immense power comes at a cost: staggering heat generation. A single GB200 chip package consumes up to 2700 W of power. With such high power in such a compact space, traditional air-cooling systems simply can’t keep up.
Mastering SONiC: 6 Essential Points to Grasp for Open Networking Success
SONiC (Software for Open Networking in the Cloud) is an open-source network operating system that differs significantly from other network operating systems you’ve encountered before. Learning SONiC requires new mental preparation and skill reserves. As a new operating system that fundamentally transforms network architecture, the following key insights and abilities
Detachable Fiber Connection Technology in CPO Systems
In the rapidly evolving world of high-speed data communication, Co-Packaged Optics (CPO) technology stands out as a game-changer. By integrating optical and electronic devices into a single package, CPO overcomes the bandwidth limitations of traditional electrical interconnects. At the heart of a successful CPO system lies a critical component that
NVIDIA Launches Spectrum-XGS Ethernet Technology: From Scale-Up/Out to Cross-Domain Scaling!
In the lead-up to the 2025 Hot Chips conference, NVIDIA officially unveiled the Spectrum-XGS Ethernet technology. This innovative solution, based on network optimization algorithms, introduces “scale-across” capabilities, breaking through the power and space physical limitations of single data centers. It connects multiple data centers distributed across different cities and countries
Related Articles
800G SR8 and 400G SR4 Optical Transceiver Modules Compatibility and Interconnection Test Report
Version Change Log Writer V0 Sample Test Cassie Test Purpose Test Objects：800G OSFP SR8/400G OSFP SR4/400G Q112 SR4. By conducting corresponding tests, the test parameters meet the relevant industry standards, and the test modules can be normally used for Nvidia (Mellanox) MQM9790 switch, Nvidia (Mellanox) ConnectX-7 network card and Nvidia (Mellanox) BlueField-3, laying a foundation for
Optical Modules and PCBs: Driving High-Speed Data Transmission in the AI Era
In the fast-paced world of data communication, the demand for efficient, high-bandwidth solutions has never been greater. As AI-driven applications and massive data processing push the boundaries of network performance, optical modules and their integral optical module PCBs have evolved rapidly to meet these challenges. This evolution not only enhances transmission efficiency
Hotchip 2025 Day 0 Tutorials: Essential Insights on AI Workloads, Rack Architectures, and Custom GB200 Solutions
In the ever-evolving world of AI and data center technologies, Hotchip 2025 kicked off with an enriching Day 0 Tutorials lineup. As a staple event in the industry, this year’s sessions served as an appetizing prelude, focusing on data center racks in the morning and kernel programming in the afternoon.
Deep Dive into NVIDIA GB200 Liquid Cooling Plate Design: Advanced Liquid Cooling for AI Chips
Next-generation AI chips like NVIDIA’s GB200 are pushing the boundaries of performance. But this immense power comes at a cost: staggering heat generation. A single GB200 chip package consumes up to 2700 W of power. With such high power in such a compact space, traditional air-cooling systems simply can’t keep up.
Mastering SONiC: 6 Essential Points to Grasp for Open Networking Success
SONiC (Software for Open Networking in the Cloud) is an open-source network operating system that differs significantly from other network operating systems you’ve encountered before. Learning SONiC requires new mental preparation and skill reserves. As a new operating system that fundamentally transforms network architecture, the following key insights and abilities
Detachable Fiber Connection Technology in CPO Systems
In the rapidly evolving world of high-speed data communication, Co-Packaged Optics (CPO) technology stands out as a game-changer. By integrating optical and electronic devices into a single package, CPO overcomes the bandwidth limitations of traditional electrical interconnects. At the heart of a successful CPO system lies a critical component that
NVIDIA Launches Spectrum-XGS Ethernet Technology: From Scale-Up/Out to Cross-Domain Scaling!
In the lead-up to the 2025 Hot Chips conference, NVIDIA officially unveiled the Spectrum-XGS Ethernet technology. This innovative solution, based on network optimization algorithms, introduces “scale-across” capabilities, breaking through the power and space physical limitations of single data centers. It connects multiple data centers distributed across different cities and countries