Detachable Fiber Connection Technology in CPO Systems

In the rapidly evolving world of high-speed data communication, Co-Packaged Optics (CPO) technology stands out as a game-changer. By integrating optical and electronic devices into a single package, CPO overcomes the bandwidth limitations of traditional electrical interconnects. At the heart of a successful CPO system lies a critical component that determines its practicality and manufacturability: the detachable fiber connector. As a leader in AI-enabled communication networks, FiberMall specializes in providing cost-effective optical communication products and solutions for global data centers, cloud computing, enterprise networks, access networks, and wireless systems. If you’re exploring high-quality, value-driven options in this space, FiberMall is your ideal partner—visit our official website or contact our customer support for more details.

Understanding the Complete CPO Solution

The foundation of any effective CPO system begins with understanding how fiber connections are integrated throughout the entire signal path. Modern CPO architectures require sophisticated connection schemes, extending from the Photonic Integrated Circuit (PIC) level all the way to system-level interconnects.

Figure 1: A complete CPO scheme includes module connectors, host connectors, MPC36, SN-MT backplane connectors, and optical backplane connectors distributed across multi-chip module systems.

A comprehensive view reveals how Detachable Fiber to Chip Connectors (D-FAU) serve as foundational building blocks, enabling the entire CPO ecosystem to function. These connections must address the high-density demands of front-panel requirements, the flexibility and scalability needed for mid-board applications, and maintain robust, repeatable performance at the backplane level.

The Importance of Detachability

The necessity for detachable connections in CPO systems stems from economic and practical considerations, which become evident when examining real-world manufacturing scenarios. Consider the challenges of handling a Multi-Chip Module (MCM) with over 1000 permanently attached fibers around its perimeter—such a setup is nearly impractical for manufacturing, testing, or maintenance.

Figure 2: The complexity of handling an MCM with 1K+ fibers, showcasing detachable connection options including electrical detachable, mid-board optical detachable, package edge detachable, and chip edge detachable configurations.

When a single fiber failure could compromise an entire expensive multi-chip module, the economic argument becomes compelling. Detachable connections provide multiple strategic intervention points, allowing isolation and resolution of issues without sacrificing the entire assembly. This technology identifies three primary optical detachment strategies: mid-board connections using short jumpers, package edge receivers permanently sealed into the package, and the most advanced chip edge detachable connection methods that interface directly with the optical engine.

Beam Expansion Technology for Relaxed Tolerance Requirements

One of the most significant technical challenges in CPO systems involves achieving reliable optical coupling while maintaining reasonable manufacturing tolerances. Traditional direct fiber connections require extremely precise alignment, making them impractical for detachable applications that need repeated connections.

Figure 3: Beam expansion technology with Mode Field Diameter (MFD) between 35-50 microns, providing an optimal balance between linear and angular misalignment tolerances, including performance curves and crosstalk analysis.

Beam expansion technology addresses this challenge by intentionally enlarging the beam diameter, creating a more forgiving alignment environment. A sweet spot emerges when the mode field diameter reaches approximately 35 to 50 microns, offering the best compromise between linear offset tolerance (which improves with larger beam diameter) and angular misalignment sensitivity (which becomes more critical with larger beam diameter). This approach also helps minimize crosstalk between adjacent channels while maintaining the 127-micron pitch required for high-density applications.

Advanced Optical Engine Integration

The integration of beam expansion technology into practical optical engines demonstrates the sophistication required for modern CPO implementations. TSMC’s Compact Universal Photonic Engine (COUPE) exemplifies how advanced semiconductor processes can be combined with precise optical interfaces.

Figure 4: TSMC’s Compact Universal Photonic Engine, featuring embedded meta-lenses, surface coupling solutions, and performance characteristics including 1.2 dB coupling efficiency and 25 nm bandwidth.

This system achieves outstanding performance metrics, including approximately 1.2 dB coupling loss per half in optical loopback and maintains a 25-nanometer operating bandwidth. The embedded meta-lens approach enables surface coupling via one-dimensional gratings, albeit requiring extremely tight angular tolerance control of plus or minus 0.1 degrees. Compatibility with TSMC’s CoWoS (Chip on Wafer on Substrate) process highlights how CPO technology leverages existing advanced packaging infrastructure.

High-Density Connector Solutions

Meeting the density requirements of modern CPO systems demands innovative connector designs that maximize fiber count while preserving the precision needed for reliable optical performance. The development of metal photonic integrated circuit connectors represents a significant advancement in achieving these competing goals.

Figure 5: Various metal photonic integrated circuit connector configurations (8F, 16F, 20F, 36F) with 127-micron pitch, and detailed cross-sectional views showing metal optical platforms for expanded beam coupling with silicon photonic chips.

These connectors utilize precision metal optical platform technology to achieve the necessary mechanical stability while accommodating fiber counts ranging from 8 to 36 in a compact form factor. The 127-micron pitch aligns with beam expansion requirements, while precision metal V-groove structures ensure repeatable fiber positioning. Thermally stable frame designs address coefficient of thermal expansion mismatches that could otherwise affect optical alignment during temperature variations.

Precision Alignment Methodology

The success of detachable CPO connections ultimately hinges on sophisticated alignment strategies that balance the competing demands of precision, mechanical stability, and connection convenience. Understanding the trade-offs between different constraint methods provides insight into optimal design choices.

Figure 6: Comparison of over-constrained, exactly constrained, and kinematic coupling methods, showing Senko’s precision alignment solution positioned between multi-contact points and minimal contact points for optimal performance.

This spectrum ranges from over-constrained systems that provide maximum stiffness and precision through conformal surface contacts, to exactly constrained kinematic couplings that offer unique positioning and thermal stability through minimal contact points. Senko’s precision alignment solution occupies a middle ground, providing improved precision and stiffness compared to exactly constrained systems while maintaining nearly equivalent repeatability and supporting multiple detachable cycles. This approach requires moderate preload forces and offers improved structural dynamics through shorter unsupported spans and enhanced damping characteristics.

Manufacturing Integration and Cost Optimization

The path to commercial viability for CPO technology requires manufacturing processes that achieve the necessary precision while maintaining reasonable costs and yields. Wafer-level integration of detachable connections is a key step in realizing this goal.

Figure 7: Simplified wafer-level process flow for Senko’s detachable FAU implementation, showing progression from silicon photonic wafer through meta-lens mounting, receiver mounting, testing, dicing, and final packaging stages.

This manufacturing approach enables wafer-level testing before dicing, significantly reducing failure costs by identifying issues prior to expensive packaging operations. The process accommodates both passive and active alignment techniques and integrates seamlessly with existing semiconductor manufacturing infrastructure. Multiple reflows and flexible cleaning processes are required throughout the journey from wafer to final multi-chip module, but the ability to perform passive testing at each stage provides critical yield optimization opportunities.

The integration of detachable fiber connections into CPO systems not only represents a technical achievement but also unlocks a new paradigm for high-bandwidth optical computing, where the advantages of photonic integration can be realized without compromising practical requirements for manufacturing, testing, and field maintenance that make commercial deployment feasible.